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HT-R490 BGA rework station
OperationManual
Table of Contents
(A) introduce the basic functions of machine parameters and
(B) the combination of machine parts
(C) of the function of each machine introduction and operation precautions
(D) of the machine operating system and Features
(E) BGA solder frequently asked questions
(F) reference temperature curve
(Vii) technical support contact
Dear
Customer:
Thank you for choosingournewestBGArework equipment,device withthe industry's mostadvanced integratedintelligent controlsystem-ICS (Intelligent Control System) addsintelligenttemperaturecontrol system andintelligent faultdetectionandwide voltageIntelligentenergy-saving functionand mute function. K-typethermocoupleimportedclosed-loop controlsystem canautomaticallycompensate fortemperaturecontrolin order to achievemore precisetemperature control; is asufficientguide theindustry'sadvanced equipment. Willbring youmoreintuitiveto useand morecomfortablefeel.
(A)introduce the basic functions of machine parameters
and
(A) of the machine parameters and basic functions introduced
Basic parameters of the machine:
1 Power: Single phase 220V AC 50/60HZ
4KVA
2 Total power: 4000W
The upper heating power: 800W
Bottom heating power: 800W at the bottom of
infrared heating power: 2400W Standby power: ¡Â 10W
3 temperature control mode: High-precision
K-type thermocouple closed-loop control, with electronic temperature
compensation.
4.PCB positioning mode: V-groove + Z fonts
universal fixture pairs of Y-direction adjustment
5 PCB size: MIN 10mm * 10mm MAX 350mm *
400mm
6. Infrared Preheating area: 210mm * 340mm
Machine Dimensions: (or so) wide and 580mm
* (before and after) long 580mm high 650mm
Machine weight: Net weight 35KG
New features:
A: the world's most
advanced "intelligent control system (Intelligent control system),
referred to as" ICS ", BGA
rework desoldering more humane, more simple, more intelligent.
B: The superior fault alarm function, the
following fault detection and alarm control system integration:
1: K-type thermocouple open circuit detection and fault alarm
protection. So that the temperature out of control, such as temperature
overshoot fault no longer occurs.
2: up and down the hot
air fan fault detection and fault alarm protection. Heater burnout phenomenon
as history, to maximize the protection of machinery and personal safety.
3: heater fault detection and fault alarm,
the machine's real-time status at a glance.
C: upper and lower blast volume electronic smart speed. Ask each
group to different temperature curve to
match the different wind speed, improve repair efficiency, enhance the repair
success rate. Exempt from the tedious and repetitive traditional machine
mechanical wind speed adjustment.
D: double-Y direction PCB clamping bracket
to meet the larger PCB fixed.
Basic functions:
1 Precision imported raw materials (PLC.
heater) precise control of BGA desoldering process.
2 The machine uses the independent control
of three-zone temperature control is more accurate. The first temperature zone.
Second temperature zone can be set in paragraph 8 liters (down) 8 segments
constant temperature control, which can store 10 groups of temperature curve.
The third zone warm-up, independent temperature control to ensure fully preheat
the PCB during the soldering process,
3 Selection of imported high-precision
thermocouples, precise temperature detection.
4 walk alone the temperature curve in the
upper heating and bottom heating, cross-flow fan rapid cooling principle to
ensure that the PCB during the soldering process, will not be deformed.
5 demolition welding and welding finished
20 seconds ahead of progressive alarm with a vacuum suction pen, convenient
desoldering suction trips to the BGA
6 PCB positioning using a V-shaped slot,
flexible and convenient removable universal fixture, PCB protection.
For large thermal capacity of PCB and other
high temperature requirements of lead-free soldering and so can easily handle.
Hot air Tsui 360 degree rotation, easy to
replace. With a variety of size of hot air nozzle, special requirements can be
customized for notebook computer motherboard, desktop computers, motherboards,
and other large-scale circuit board repair, and cell phone motherboard micro
maintenance of the chip
(B)Introducethe
basic functions ofthe machine
1: head
heater limit rod. (To prevent head heater crushed PCB)
2: head
heater. (Temperature zone)
3: The
head heater adjust the handle up and down. (Adjustable up and down position)
4: LED
lights. (Increase the brightness of the work area)
5: head
heater, hot air nozzle. (Can be replaced according to different chip size)
6:
Infrared heating panels warm-up area. (Third zone)
7: PCB
clamping bracket. (Fixed PCB board with a holding device)
8: PCB
clamping bracket locking screw. (Tighten the right side of the PCB clamping
bracket)
9: The
display and control buttons. (Show and set parameters)
10: the
upper heater, locking handle and move around.
11: the
upper part of the heater cable
12: the
lower part of the heater and wind mouth. (Second temperature)
13: shaped
plate fixture and tighten the screws.
14: shaped
plate fixture. (Clamping irregular PCB, such as notebook panels)
15:
plywood jig and move around to tighten the screws.
(B) the combination of machine parts
(1) The head of ejector assembly¡£
(2)shaped
plateas sembly fixture.
(3) the lower nozzle assembly screw thimble¡£
(4) PCB assembly thimble screw.
(C)of the function of each machine
introduction and operation precautions
Step 1: Select to set a goodtemperaturecurve.
Step two:Select the appropriatehot-airnozzletothe center ofthe upper and lowertemperature zonealigned.
See below
The third step: the transferredzoneonthe topposition, holdinggoodthe badplateweldedto be demolished, theareatransferred to thenozzletemperatureonthe edge ofthe chipfromabouta distance of about3-5MM.
Transferred
tothe nextzoneto withstandthe windthe mouth of thethimblelowerPCB, pay attention toavoidthe lowercomponent. Figure:
Step Four:Press
the startbuttonfor 2-3 seconds,the machine starts, observe theballchanges,such asaballcannotstart themeltingtemperatureto extend thepausebuttontime.
(D) part of the operating
system and machine control functions introduced
I.Introductionpanelbuttonsanddisplaycontents
1:Introductiondisplay
| Item column | Display content |
¨ç | Curve Name field | Eachcurveisrepresentativeof theICwith amodelnameduserchoose to use |
¨è | Curve number field | The machine canremember0-9a total oftencommonly usedparametersfor the user tochoose |
¨é | Machine status indication bar | Indicatesthe current workingstatemachine, a total of "Settings", "Run," "pause","cool", "stop" the five states |
¨ê | Columnindicatesthe currentnumberof curve segments | Displays the currentoperatingcurvesegment number, including the 1-8segment elevationandtemperaturephase |
¨ë | Run time remaining indicator bar | Running time remaining display unit for the second |
¨ì | Fan speed indicator bar | The current fan speed display, 0-9, were Ten Speed |
¨í | Passwordinput fieldor the currenttemperature indicator | 1: In the set statewhenthe passwordinput field 2: In the runningfor thefirst, second,third zoneof the measuredtemperature |
¨î | The firstcolumnindicatesthe set temperaturezone | The current time zone of the first set temperature |
¨ï | Parameter display area | The currentcurvesettingparameters, such asrisingslope, constant temperature, constanttime. |
2: KeyFeatures
| Item column | Press the function key |
ìé | Run / Pause | Start or pause the operation of the machine |
ì£ | Stop / Exit | Stop the machine running or exit setting mode |
ß² | Lights on / off | Lights on or off |
ÞÌ | Set / confirm key | Enter setup modeorto setparametersto determine the |
çé | Move the cursor / key addition and subtraction | Move the currentcursorposition orthe currentvalueplus or minus |
Two common operations
Functions
(I): set and modify parameters
For the user to modify the current parameters:
such as constant temperature, platform time, the slope of temperature rise, or
the curve of the name, you must first set the machine to "set" state,
in order to carry out related operations, detailed steps are as follows:
A: by (ii) Stop / Exit button, set the machine to
"stop" state.
B: Press (D) Set / confirm button, setting the
machine to: "Set" state.
C: the fan speed changes: (can not enter a
password)
In the "Set" state, if the user only
need to modify the fan speed, it can not enter a password, press repeatedly v
"right" to move the cursor to ¨ì fan speed indicator
bar, and then (d) Set / confirm button, the cursor so that high bright as then
(v) "down key", you can adjust the fan speed.
Fan speed of 0-9 were ten, of which 9 is the wind
speed maximum, minimum 1, 0 to stop. Prohibit any fan speed set to
"0"
D: curve number modification: (can not enter a
password)
Machine in the "stop" state, according
to (d) to enter the "Settings" state, if the user only needs to
modify the current curve number, can not enter a password, according to (v)
"the key" to move the cursor to the column ¨è curve number, then (iv)
Set / confirm button, so when the cursor is highlighted, then (v) "arrow
keys" to modify the current curve number.
E: Modify the curve parameters (password must be
entered before operational)
1: All in the password input box is highlighted,
move the cursor by (v) / plus or minus key "up" "down"
"left" "right" in the password input box enter the password
"123456", then (iv) Set / confirm key, such as password input box
displays "OK" indicates that the password entered successfully. Then
enter the parameters can be modified, or (iv) and then set / confirm key,
repeat steps 1. Until the password is entered successfully.
2: (v) the cursor / subtraction key "up"
"down" "left" "right", move the cursor to the
need to modify the value of the position, according to (d) Set / confirm
button, highlighting the need to modify the value, then Move the cursor by (v)
/ plus or minus key "on", "next" was changed to the desired
value.
3: When a temperature rise of a number of the
slope is set to 0, it means the end of the curve.
Note:
1: When the screen display when the cursor is half
the height of the text, such as, this time can only move the cursor (v) / plus
or minus keys to move the cursor position.
2: When the screen shows the cursor is changed to
the text height, for example, that the current value of the cursor can be
modified. Available at this time (v) the cursor / keys to set the value plus or
minus size.
(Ii) The operating status of the set
A: (i) in the stopped state, press RUN / PAUSE two
- three seconds, you can start the machine running, (vi) status indicator
"RUN" LED flashes once per second, the machine automatically move the
line to set the curve. ¨ë run remaining time indication bar under the curve parameters,
automatically calculate the total run time, and start the countdown, ¨ê the current curve
segment number field has been run to automatically update the number of curve
segments, when the "1-8" section of the figure highlighted , this
means that the curve in the current number of heating stages, and
"segment" is highlighted, then the number of the current temperature
in the platform stage. ¨î a zone set temperature indicator bar shows the current curve of
the set temperature, ¨í password input field / current temperature indicator bar shows,
in order "first zone" "second zone" "third zone"
of the measured the temperature.
B: When the curve to run to the final thirty
seconds, the machine will automatically issue a warning tone to alert the user,
and with the remaining time will be shortened, a warning tone becomes more
rapid, run to the end when sounding loudly. Automatic machine to
"cool" status, stop heating, cooling fan cooled three minutes and the
vacuum pump working one minute, ¨ë remaining time indicator bar started running three-minute
countdown,
C: (i) when the state is in the running to run /
pause button, set the machine to pause, (vi) status indicator "RUN"
LED flashes twice per second, the machine will automatically maintain the
current temperature, ¨ë run time remaining indicator bar stop the countdown.
D: In the suspended state, then i run / pause,
resume to normal operation. (Vi) status indicator "RUN" LED flashes
once per second.
E: (ii) when the state is in the running to stop /
exit button for two seconds, to stop the operation of the machine automatically
to "cool" status in the "cool" state, the cross-flow fan to
cool for three minutes, while vacuum pump work one minute, three minutes after the machine is automatically set to
stop, the user can start the next cycle of work.
(Iii) The lights on / off
Press to turn on / off LED lights.
Note: 1:
Themachinehas beenthe experienceunder theBGA rework, set the relevantvaluesof theupper and lower limits, to minimizethe customer's misuse. Detailedparameters are as
follows
1:the
first, second, third, three-zone temperatureslope of0-6degrees/sec.
2:first
and secondzone
temperatureis 30 to320 degrees.
3: The third zonetemperature
of 30to 200 degrees.
4:first,
second,third, three-zoneplatformtimefrom 0 to250 seconds.
Two:During operation, when themachinedetectsabnormaltemperatureline, it will display the appropriatewarninginformation, (vi) Thestatus indicatorof"ERR"indicator light, andsound an alarm, the machinewill automaticallystopinthe state, aftertroubleshootingcan continueto run.
(E) BGA solder frequently
asked questions
1, BGAHow do you debug, findtheir own useof the curve?
BGA chipdesoldering, is affected bya variety ofenvironmental impact, air temperature, humidity, indoorbreezeflow, PCB thickness, PCB copperdistribution. Can not be acurveinthe country,a variety of environmentscan bedonewelding, according to ourstatistics, onlyabout 45% of customers use ourcurvecannotbe adjusted.Ourfactorydebuggingenvironmentfor indoor25 degrees. Semi-closeddebugroom.Airhumidity. Debuggingmaterialis generallynotebookmotherboardNorthbridge. So, whenthis problem occurs, we want toprovide us withthe actual situationbased onthe curve, make the appropriateadjustments.
Testing method, the use of desktopor
laptopNorthbridgeNorthbridge(debug boardusingwaste, but requiresPCBlevel, try not tobe deformed, PCB nodeterioration). Not recommendedorsmallernotebook graphicschiptemperaturedebugging.
Theweldingof theboard, the use of clampsclampingformation,firstobservedin thefourth paragraph of thecompletesetrunningtime, observe the line ofthe testtemperaturefromthe temperature, the ideal temperatureislead-freecurvecan reach217degrees, the curvehasleadto183degrees.These twotemperaturesislead-freeandlead-melting point materials. But this timethe lower part ofthe chipsolder ballsnotmelting, from the maintenancepoint of view, the ideal temperature is235degreeslead-free, lead-200 degrees, thenmeltedand thencooledballwillreachthe idealstrength.
Lead-freesolder, for example:
Afterthe fourth paragraph ofheating, the temperature does notreach217degrees, then according to the size ofthe gapand improve thethird, four temperature.For example:the measuredtemperature reaches205degrees, then the hot airup and downindependently adjustableby 10degreeseach. Ifa big gap betweenthe measured195degrees, 30 degreesis recommendedto improvethe bottom, raisethe upper20 degrees, the upper temperature should
notincreasetoo much, so as to avoidthermal shockofthe chipis too large.
Afterheating, the
fourth paragraph ofthe
temperaturereached217degrees, for the ideal state, if it is over220 degrees, will have toobserve thefifth paragraph(maximum temperature above)before the end ofthe chipto reachthe maximum temperature. Advisablenot to exceed240 degrees. Ifmore thanmore,may be appropriate tolower thetemperature ofthe fifth paragraph.
2, thewelding,
the bottom bracket on thePCBboardthimblenot alwayswithstandthe same time,
some feetto thetop ofthe component, howdo?
PCBonthe bottom of thebrackethas beendesignedthimblewecan adjust theheightby turningthe screw, according to the sixfootlevel ofthe differencecan beflexibleto adjustthe height ofsixfeet. Feettothe topcomponent, may be appropriate tostagger1-2mm.
3, theair volume
controlWhat is the role?
We providenozzlesizesfrom25mmto40mmfivekinds of specifications,even ifthe sametemperature setting, using a differentnozzle, the finalheating temperatureof the chipis different. The smaller thenozzle, the higherthe heatwithinthe sameunit, the chiptemperatureishigher, thisis a verysimple truth, all the hot airweldingequipment, arenot escapethis law.When thesmallerchipweldingwhenusing smallernozzles, air volume controlknobcan bepassed, the wind speedreduction, say thisgreatly reducesthechance ofexplosionchip.
Of course, anotherway
is toincreasethe appropriatedistance from thenozzleto thechip, an appropriate increase in1-2mm,sothe chipwill greatlyreduce theheat.
1,
welding 775CPU seat to pay attention to what issues?
775 of the PCB copper distribution is very uneven, is near the
outer half of the copper ground wire and power distribution, on the inside of
the half then all of the PCB signal line. According to our tests, 775CPU Block
PCB temperature difference between the two largest copper can reach 20 degrees,
it is because a lot of ground and power supply copper PCB heat divergence to
other locations.
775, direct plus welding (not removed, then welded
directly once), you must use liquid flux.
775 When welding, be sure to remove the metal
cover the new socket.
Nozzle selection must be appropriate to select and
775 within the frame of the same size plastic nozzles.
When welding, be sure to keep holding fixture
socket 775 can smooth. Do not bother, to be repeated by adjusting the lower
part of the nozzle to ensure that the top part of the 775 PCB level.
2,
the choice of solder paste
Recommended to use environment-friendly liquid
flux (for additional welding), or BGA special paste. But notes that: BGA solder
paste is a limitation of use, high temperature solder paste to preserve the
environment can easily lead to failure. Such as 30 degrees room temperature,
direct sunlight, within 10 days of solder paste is completely degenerate.
Solder paste deterioration, will be completely lost flux effect. Please select
the shady, cool place to store BGA solder paste.
3.
BGA soldering cleaning
Recommend the use of a dedicated network of steel
plate washer water with ultrasonic cleaning. After a ball is not recommended to
use recycled, once contaminated with dust and eyes can not see a small amount
of solder paste, the next time the plant will cause trouble. PCB recommends
using clean cloth dipped in clean water washer. Plant is completed. Do not
allow hand-ball, sweat or grease contamination after the failure may be caused
by welding. Remember: the details determine success or failure.
4.
Explosion on chip chip issues and how to save
BGA chip soldering, I heard a slight crackling
sound, we may be called the explosive bridge, the bridge explosion caused no
more than two reasons: First, the air flow is uneven, a point the temperature
is too high, resulting in explosive bridge; second chip internal humidity,
moisture, welding process, rapid spillover of water vapor, resulting in short
circuit or chip the copper circuit. PCB will have this same problem, a serious
damp layer PCB board likely to cause serious short and deformed. So for some
time longer to place the chip, the proposed drying operation, the drying is
done using a simple repair station on the chip temperature of 150 degrees, 15
minutes of heating time. Professional approach is to use the oven at 100
degrees, the entire piece of board and chip for 10 hours of drying.
Chips stored in the indoor environment, even if
the new chips will still absorb moisture from the air, causing damage, so it is
recommended to buy Cabinets (generally used to store drugs) to save the chip.
5,
How to Take Glue chip?
If the use of temperature on the bottom line of
BGA chip to test the temperature of 230 degrees, this time, the ball has melted
but why take the chip as usual approach, the chip holding forceps not get down,
because the adhesive of the chip, so hard Take, then force will take off point?
No. Because the pad on the tin has melted into a liquid state, while the glue
is between perfusion in the ball and did not stick on the pad of course not
hard to take off points.