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- ½Åû: Desoldering Welding Repair
- Áß·®: 40g
- ¸ðµ¨ ¹øÈ£: MECHANIC HBD-366
- Àç·á: ÁÖ¼®
- ±Ù¿ø: CN (Á¤Ç°)
- Melting Point: 210 Degrees
- Diameter: 0.6 0.8 0.5 0.4 0.3MM
- Model Number: HBD-366 Solder Wick
- Flux Content: Sn42% Bi58%
- Feature1: soldering wire
- Feature2: Solder wire lead free
- Wight: 40G
MECHANIC HBD-366 Solder Wire Lead Free Low Temperature 210¡É Melting Point Soldering Wire 0.6/0.8/0.5/0.4MM for BGA Solder Wire
Specification:
Diameter:0.3mm/0.4mm/0.5mm/0.6mm/0.8mm
Melting Point: 210 degrees
Material: SN42Bi58
Features :
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Mechanic High Purity Tin Solder Wire Lead-free Solder Melt Rosin Core for phone repairing, phone circuit board repair solder tin wire, Good solder-ability, insulation resistance, solder tin wire Lead Rosin Core for Welding Tool, no spattering and non-corrosive, Low Melting Point and High Brightness Solder.
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With a low melting point, usually used in iron soldering with bright and full soldering points for phone circuit board repair, It is affordable and convenient to operate
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Excellent performance in desoldering, It is widely used in electrical and electronics, solder parts like phone motherboard circuit board, electronics devices and others
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Less residue, bright spot, reliable.
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Soldering performance is good.
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During soldering spatter less, smoke less, smell feel relaxed.
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Corrosive small.
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Easy to carry and it is sure an electronic enthusiasts essential gadget.
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Melting point : 210¡ÆC
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