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- ¸ÂÃã °¡´É À¯¹«: ¾Æ´Ï´Ù
- ÆÐÅ°Áö: BOX
- ¸ðµ¨ ¹øÈ£: WL BGA Reballing Stencils
- ½Åû: ÄÄÇ»ÅÍ µµ±¸ Å°Æ®
- À¯Çü: Á¶ÇÕ
- DIY ¿ëÇ°: Àü±â
- ºê·£µå À̸§: DIYPHONE
- Áõ¸í¼: ¼¼·ý
- ±Ù¿ø: CN (Á¤Ç°)
- Application: Mobile phone repair
- Type: WL NAND Baseband IC Positioning Mold
- Item: WL BGA Reballing Stencils
- Function: NAND and Baseband Soldering Repair
- Support: for iPhone 6 7 8 X XS XR XS Max 11 12 Pro max
- Features: high-accuracy
- Used: For Iphone IC Baseband NAND CPU Welding Repair
¿É¼ÇÁ¤º¸[(10)6S 6SP Baseband NAND][(29)7 7P Baseband NAND][(173)12pro max Baseband][(175)11-11PMBaseband NAND][(366)XS MAX NAND Baseband][(201456597)Magnetic Base][(201456596)6 6P Baseband NAND][(100018814)5 5C5S Baseband NAND]WL-°íÇ°Áú ºü¸¥ ¼Óµµ BGA ¸®º¼¸µ ¼Ö´õ ½ºÅÙ½Ç ÅÛÇø´, °ñµå Æ÷Áö¼Å´× ¸ôµå Æ÷ÇÔ, ¾ÆÀÌÆù 12 11 ÇÁ·Î ¸Æ½º X XR XS xs¸Æ½º 8 7 6 5C NAND º£À̽º ¹êµå ³³¶« ¼ö¸®
¼³¸í:
WL-¸¶±×³×ƽ NAND BGA ¸®º¼¸µ ½ºÅÙ½Ç ÅÛÇø´, ¾ÆÀÌÆù XS ¸Æ½º¿ë Æ÷Áö¼Å´× ¸ôµå Æ÷ÇÔ, ³³¶« ¼ö¸® µµ±¸ Å°Æ®, WL NAND BGA ¸®º¼¸µ ½ºÅÙ½Ç ³×Æ®, ¾ÆÀÌÆù ¸¶´õº¸µå ¼ö¸®¿ë ºí·¢ Æ÷Áö¼Å´× ¸ôµå Æ÷ÇÔ WL °íÇ°Áú ³³¶« BGA ¸®º¼¸µ ½ºÅÙ½Ç °íÁ¤ Ç÷¹ÀÌÆ®, °íÁ¤¹Ð Àüȱ⠺£À̽º ¹êµå BGA ¸®º¼¸µ ½ºÅÙ½Ç ÅÛÇø´, ¾ÆÀÌÆù 5 6 7 8 X XS XR XS Max NAND º£À̽º ¹êµå ³³¶« ÀçÀÛ¾÷
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¸¶±×³×ƽº£À̽º + Æ÷Áö¼Å´× Ç÷¹ÀÌÆ® + ÁÖ¼® ¸Þ½Ã, (ÇÔ²² »ç¿ë)
WL BGA ¸®º¼¸µ ½ºÅÙ½Ç Å°Æ®, °ËÁ¤»ö Æ÷Áö¼Å´× ¸ôµå Æ÷ÇÔ
WL °íÁ¤¹Ð BGA ¸®º¼¸µ ½ºÅÙ½Ç ÅÛÇø´, ¾ÆÀÌÆù 5S 6 6P 7 8 X XS Max ³½µå ¹× º£À̽º ¹êµå ³³¶« ¼ö¸®
0.1mm µÎ²², ³ôÀº °æµµ, °ÅÀÇ º¯ÇüµÇÁö ¾ÊÀ½, BGA ¸®º¼¸µ ¼Ö´õ ÀÛ¾÷ÀÇ ¼º°ø·ü Áõ°¡, ¾ÆÀÌÆù CPU ¹× nand¿ë ÃÖ°í Ç°ÁúÀÇ BGA ¸®º¼¸µ ½ºÅÙ½ÇÀÔ´Ï´Ù. 6 6P 6S 6SP 7 7P 8 8P X XR XS XS Max ¿ë
[¼±Åà À¯Çü]:
¿É¼Ç 1: ¾ÆÀÌÆù 5/5s º£À̽º ¹êµå ¹× ³½µå
¿É¼Ç 2: ¾ÆÀÌÆù 6/6P Baseband NAND
¿É¼Ç 3: ¾ÆÀÌÆù 6S/6SP º£À̽º ¹êµå ¹× ³½µå
¿É¼Ç 4: ¾ÆÀÌÆù 7/7P Baseband NAND
¿É¼Ç 5: ¾ÆÀÌÆù 8/8P/X Baseband NAND
¿É¼Ç 6: iPhone XS MAX XR º£À̽º ¹êµå ¹× ³½µå
¿É¼Ç 7: ¾ÆÀÌÆù 11-11 ÇÁ·Î ¸Æ½º º£À̽º ¹êµå ¹× ³½µå
¿É¼Ç 8: ¾ÆÀÌÆù 12-12 ÇÁ·Î ¸Æ½º º£À̽º ¹êµå ¹× ³½µå
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