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- ºê·£µå À̸§: DIYPHONE
- DIY ¿ëÇ°: Àü±â
- À¯Çü: Other
- ¸ðµ¨ ¹øÈ£: For Huawei Power IC
- ÆÐÅ°Áö: BOX
- ½Åû: Other
- Å©±â: 0.12mm
- Item Name: For Huawei Power IC BGA Reballing Stencil
- Material: Imported Japan Steel Sheet
- Application: for Huawei Power IC BGA Reballing
- Type 2: For HI BGA Reballing Stencil
- Model Number 2: HI6555 HI6561 HI6553 HI6422 HI6421GFC HI6421 B HI6522 HI6551 HI6523
- Thickness: 0.12mm
- Features 1: Multi-purpose Huawei HI series Power IC BGA Reballing
- Features 2: High-Quality Huawei Phone Power IC Repair Assistant
- Function: for Huawei Phone Motherboard Repairing
- Design: Anti-Drum Design of Heat Dissipation Hole
- Suitable for: For Huawei Power IC BGA Rework
- 100%: High-Quality
- Advantage: High Temperature Resistant, Avoid Hump
- Packing: Bag
PHONEFIX AMAOE BGA Àç ÀÛ¾÷ ³×Æ® È¿þÀÌ HI6555 HI6561 HI6553 HI6422 HI6421GFC HI6421 B HI6522 HI6551 HI6523 ÆÄ¿ö IC Reballing ½ºÅÙ½Ç 0.12mm HeatingTemplate ¼ö¸® Å°Æ®
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- È¿þÀÌ ÆÄ¿ö IC BGA Àç ÀÛ¾÷ ³×Æ® Reballing ½ºÅÙ½Ç, °íÇ°Áú È¿þÀÌ Æù ÆÄ¿ö IC BGA Reball Rework repair assistant
- ¼öÀÔ ÀϺ» °ÆÇ, °íÇ°Áú ¾ÆÀÌÆù ¼ö¸® µµ±¸.
- ÃÖ°í compacity: HI6555 hi6561¸¦ À§ÇØ »ç¿ëÇÏ´Â HI6553 HI6422 HI6421GFC HI6421 B HI6522 HI6551 HI6523 Èû IC BGA Reballing ¼ö¼±.
- Ưº°ÇÑ µðÀÚÀÎ:¿ ºÐ»ê ±¸¸ÛÀÇ ¹Ý´ë·Î µå·³ µðÀÚÀÎÀº, bulges¸¦ ¹æÁöÇÏ°í BGA reballing ½ºÅÙ½½ ÅÛÇø´¿¡ ÇèÇÁ¸¦ ÇÇÇÕ´Ï´Ù.
- ´Ù¸ñÀû È¿þÀÌ ÇÏÀÌ ½Ã¸®Áî ÆÄ¿ö IC BGA reballing ½ºÅÙ½Ç ÅÛÇø´Àº È¿þÀÌ ÀüÈ ¸¶´õ º¸µå ¼ö¸®¿¡ °¡Àå ÀûÇÕÇÑ ¼Ö·ç¼ÇÀ» Á¦°øÇÕ´Ï´Ù.
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- ¹°ÀÚ: ¼öÀÔµÈ ÀϺ» °Ã¶ÆÇ
- »ö»ó: ±×¸² ¼î
- À¯Çü:ÇÏÀÌ BGA Reballing ½ºÅÙ½Ç
- ¸ðµ¨ ¹øÈ£: huawei¸¦ À§ÇØHI6555 HI6561 HI6553 HI6422 HI6421GFC HI6421 B HI6522 HI6551 HI6523
- µÎ²²: 0.12mm
- µðÀÚÀÎ:¿ ºÐ»ê ±¸¸ÛÀÇ ¹Ý´ë·Î µå·³ µðÀÚÀÎ
- 100%: °íÇ°Áú
- ½Åû:Huawei Power IC BGA Reballing
- ´ÜÀ§ À¯Çü: Á¶°¢
- Á¤Àå:È¿þÀÌ ÆÄ¿ö IC BGA Àç ÀÛ¾÷
- ±â´É:Huawei ÀüÈ ¸¶´õ º¸µå ¼ö¸® ¿ë
ÆÐÅ°Áö¿¡ ¹«¾ùÀΰ¡?
- 1 *HI Power BGA Reballing ½ºÅÙ½Ç
![070](https://ae01.alicdn.com/kf/HTB1STWoKpzqK1RjSZFvq6AB7VXaZ.jpg)
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