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- ºê·£µå À̸§: DIYPHONE
- DIY ¿ëÇ°: Àü±â
- À¯Çü: Phone repair tools
- ¸ðµ¨ ¹øÈ£: UV50/80
- ÆÐÅ°Áö: BOX
- ½Åû: for phone repairing
- Å©±â: BGA Solder Flux Paste
- Item Name: BGA Solder Flux Paste Soldering Tin Cream
- Material: Rosin Tin Flux Cream Soldering
- Application: for Phone BGA Board Soldering Fixing
- Features 1: PC Cards Electronic Chip-level Welding
- Features 2: High Synthetic Solder Paste
- Function: for PCB, SMD, PGA Welding Repairing
- Type 1: Rosin-based Solder Paste
- Granularity: 0.22um
- Viscosity: 0.2 Pas
- Number of Pieces: One Piece
- Compacity: for Phone Computer Circuit Board Repairing
- DIY Supplies: Electrical
- Packing: Aluminum Box
- Features 3: IC and PCB for No corrosive
¿É¼ÇÁ¤º¸[(201336230)MCN-UV 80][(4)MCN-UV 50]
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100% ¾ÆÁÖ »õ·Î¿î °íÇ°Áú.
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°í ÇÕ¼º BGA ¼Ö´õ ÆäÀ̽ºÆ® ƾ, ·ÎÁø ±â¹Ý Ç÷°½º ÆäÀ̽ºÆ® Å©¸²
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PH °ª Á߸³, Àý¿¬ °ÇÏ°í, ¿ëÁ¢ Ç¥¸é ¸Å²ô·¯¿î.
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Àü¹®PC Ä«µå¿ë ³³¶« ÁÖ¼® Ç÷°½º, ÀüÀÚ Ä¨ ·¹º§ ¿ëÁ¢
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±×°ÍÀÇ ²ú´Â Á¡Àº ³³¶«ÀÇ À¶Á¡º¸´Ù ¾à°£ ³ô½À´Ï´Ù.
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ÁÁÀº ³³¶« ¹× ¿ëÁ¢ µµ±¸.
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ºÎ½Ä¼º ¾øÀ½¿ë IC ¹× PCB
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½´ÆÛ ÄÄÆÑƼ: PCB, BGA, SMD, PGA ¼ö¸® ¼ö¸®, ³³¶« µî¿¡ Àû¿ë °¡´É
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·ÎÁø ±â¹Ý ¼Ö´õ ÆäÀ̽ºÆ®.
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¿É¼Ç 1: MCN-UV 50
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¿É¼Ç 2: MCN-UV 80
Á¦Ç° »ç¾ç
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ÀçÁú: Çöó½ºÆ½ ·ÎÁø ±â¹Ý ¼Ö´õ ÆäÀ̽ºÆ®
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Å©±â: 80, 50
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ŸÀÔ: ·ÎÁø ±â¹Ý BGA ¼Ö´õ Ç÷°½º Å©¸²
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¸ðµ¨ ¹øÈ£: UV 50/80
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Á¡µµ: 0.2Pas
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¼¼ºÐÈ: 0.22um
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ÀÀ¿ë ÇÁ·Î±×·¥: ÀüÈ BGA º¸µå ³³¶« °íÁ¤
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±â´É: PC Ä«µå ÀüÀÚ Ä¨ ·¹º§ ¿ëÁ¢
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³³¶« Àü¿¡ ¹°Ã¼ Ç¥¸éÀ» ´ÛÀ¸½Ê½Ã¿À.
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ÆäÀ̽ºÆ® Ç÷°½º¸¦ ¼Ö´õ Á¶ÀÎÆ®¿¡ ¹Ù¸¨´Ï´Ù.
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1 * MCN-UV 50 BGA ¼Ö´õ¸µ Å©¸²
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1 * MCN-UV 80 BGA ¼Ö´õ¸µ Å©¸²
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